Advanced Packaging Integration Engineer
2 Days Old
Join to apply for the Advanced Packaging Integration Engineer role at Piper Companies
1 day ago Be among the first 25 applicants
Join to apply for the Advanced Packaging Integration Engineer role at Piper Companies
Piper Companies is looking for an Advanced Packaging Integration Engineer to join a cutting-edge startup onsite in Saratoga, CA . The ideal Advanced Packaging Integration Engineer will drive the development and integration of next-generation packaging solutions for high-performance semiconductor products.
To be considered for an interview, please make sure your application is full in line with the job specs as found below.
Responsibilities for the Advanced Packaging Integration Engineer:
Lead advanced packaging initiatives, including 2.5D CoWoS and chiplet-based integration, from concept through production.
Collaborate with global teams to align packaging strategies with system-level requirements.
Own the development of test vehicles and qualification plans for multi-die and high-density packaging technologies.
Influence system architecture by integrating packaging solutions that optimize thermal, mechanical, and electrical performance.
Qualifications for the Advanced Packaging Integration Engineer:
10+ years of experience in advanced IC packaging, with a strong background in system-level integration.
Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance.
Knowledge in CoWoS technology
Strong experience with 2.5D and 3D stacking and chiplet-based architectures.
Proven ability to lead cross-functional teams and manage vendor relationships with foundries and OSATs.
Strong understanding of substrate technologies and multi-die co-design.
Bachelor’s degree in Mechanical, Electrical Engineering or Materials science background are a plus.
Compensation/Benefits for the Advanced Packaging Integration Engineer:
Salary Range: $200,000 – $275,000 annually
Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (as required by law), and Paid Holidays
This job opens for applications on August 1, 2025. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: Advanced Packaging, CoWoS, 2.5D, 3D, Stacking, Chiplet, Multi-Die Packaging, OSAT, Substrate, system integration, Semiconductor Packaging, Mechanical Engineering, Electrical Engineering, IC Packaging, Packaging Engineer, 3D, integrator, package development
Seniority level Seniority levelNot Applicable
Employment type Employment typeFull-time
Job function Job functionInformation Technology
IndustriesBusiness Consulting and Services
Referrals increase your chances of interviewing at Piper Companies by 2x
Get notified about new Packager jobs in Orange County, CA .
Assembler - Medical Packaging- 3rd shift Newport Beach, CA $30.00-$40.00 3 days ago
Newport Beach, CA $25.00-$30.00 1 week ago
Rancho Santa Margarita, CA $20.00-$28.00 1 month ago
Senior On-Site Service Specialist / Mail Processing SpecialistSr. Process Engineer - Semiconductor Packaging (Night Shift) Irvine, CA $89,100.00-$172,100.00 2 days ago
Assembly and Packaging Development Engineer Orange, CA $65,000.00-$80,000.00 2 weeks ago
Rancho Santa Margarita, CA $23.00-$26.00 1 month ago
Administrative Assistant- Data Reporting and OperationsOperations Support Coordinator & ReceptionistExecutive Personal Assistant & Office Administrator Orange County, CA $70,000.00-$80,000.00 1 month ago
Production Packaging Associate - 3rd ShiftExecutive Assistant / Personal Assistant We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
#J-18808-Ljbffr
- Location:
- California, MO
- Salary:
- $100
- Category:
- Engineering