As a top-level SOC Physical Design Engineer, you will contribute to all phases of physical design from RTL to the delivery of our final GDSII. Your responsibilities include:

Responsibilities:

Implement physical design at the large SoC chip level from RTL to GDSII, creating a design database ready for manufacturing.

Interact with IP vendors to understand IP integration requirements and integrate all blocks, IPs, and sub-chips at a large SoC level.

Collaborate with the packaging team on Microbump/Probe Bump/Bump/Pad placement.

Build full chip floorplan, including pads/ports/bump placement, block placement and optimization, block pins placement and alignment, power grid, and RDL design, etc.

Develop the chip-level clock network and clock stations in collaboration with clock experts.

Budget timing among blocks and sub-chips at the chip level, generating block/chip-level static timing constraints.

Arrange, analyze, and optimize feedthrough and repeaters among all blocks/sub-chips at the chip level.

Perform block-level place and route, ensuring the design meets timing, area, power constraints, and all sign-off criteria.

Generate and implement ECOs to fix timing, signal integrity, EM/IR violations, PV, and complete formal verification.

Integrate DFT into physical design, ensuring alignment with overall test strategies and manufacturing requirements.

Run Physical Design verification flow at chip/block level, fixing LVS/DRC/ERC/ANT violations.

Collaborate closely with architecture, frontend design, DV, and package teams to ensure cohesive design implementation and successful project tapeouts.

Minimum Qualifications

Education:

BS degree in electrical engineering, computer engineering, or a related field with 7+ years of experience in block or full-chip physical design, or

MS degree in the above fields with 5+ years of related experience.

Technical Expertise:

Deep design experience in large SoC designs, including IP integration, padring design, bump planning, and RDL routing strategy.

Extensive knowledge and practices in Physical Design, including physically aware synthesis, floor-planning, place & route, CTS, and repeater/feedthrough.

Experience in developing and implementing power-grid and clock network at chip level.

Knowledge of basic SoC architecture and HDL languages like Verilog to work with the logic design team for timing fixes.

Experience in physical design verification to debug LVS/DRC/ERC/ANT issues at chip/block level.

Exposure to 2.5D/3D packaging is preferred.

High performance and large chip design experience is preferred.

Exposure to DFT is preferred.

Proficiency in writing Linux shell scripts in Perl, TCL, and Python.

Real chip tapeout experience in 7nm and/or below with a successful signoff track record.

Self-motivated with strong problem-solving and debugging skills.

Ability to work effectively in a dynamic group environment.

Minimum Salary: $165,600.00

Maximum Salary:$238,050.00

The pay range for this position is expected to be between $165,600.00 and $238,050.00/year; however, the base pay offered may vary depending on multiple individualized factors, including market location, job-related knowledge, skills, and experience. The total compensation package for this position also includes medical benefits, 401(k) eligibility, vacation, sick time, and parental leave. Additional details of participation in these benefit plans will be provided if an employee receives an offer of employment.

If hired, employee will be in an "at-will position" and the Company reserves the right to modify base salary (as well as any other payment or compensation program) at any time, including for reasons related to individual performance, Company or individual department/team performance, and market factors.

Juniper's pay range data is provided in accordance with local state pay transparency regulations. Juniper may post different minimum wage ranges for permanent residency petitions pursuant to US Department of Labor requirements.

#J-18808-Ljbffr