Description

s. Capable of utilizing advanced Finite Element Analysis (FEA) techniques (sub-modeling approach, contact analysis, non-linear analysis), and test procedures for material characterization/testing Warpage/Stress analysis, Solder joint reliability (SJR) prediction, and board assembly process simulation analysis. Original Posting:

June 26, 2025 For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above. Pay Range:

Pay Range $104,650.00 - $189,175.00 The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.