We are looking for an experienced Process Engineer to support electronic Printed Circuit Board Assembly (PCBA) manufacturing within the aerospace and defense industry. This role is focused on optimizing Surface Mount Technology (SMT) and Thru-Hole processes to meet stringent industry and customer requirements.

Key Responsibilities:

• Develop, document, and improve PCBA manufacturing processes, with emphasis on SMT and Thru-Hole assembly.
• Ensure processes comply with aerospace and defense quality standards (e.g., AS9100, IPC-A-610 Class 3).
• Provide hands-on technical support for production, addressing process issues and implementing root cause corrective actions (RCCA).
• Collaborate with cross-functional teams during New Product Introduction (NPI) to ensure manufacturability and process readiness.
• Evaluate equipment capabilities, perform time studies, and recommend improvements to increase yield, reduce defects, and support lean manufacturing initiatives.
• Support audits and customer reviews with process documentation, data, and technical explanations.

Qualifications:

• Bachelors degree in Mechanical, Electrical, or Manufacturing Engineering (or related field).
• 25 years of experience in PCBA manufacturing within the aerospace or defense sector.
• Strong knowledge of SMT and Thru-Hole assembly, soldering standards (IPC-A-610/IPC-J-STD-001), and aerospace quality requirements.
• Experience with SMT equipment (pick-and-place, reflow ovens, AOI/X-ray) and thru-hole soldering (wave/selective soldering).
• Familiarity with root cause analysis tools (5 Whys, Fishbone, FMEA) and process validation methodologies.