Advance Packaging Engineer
6 Days Old
Responsibilities of the Advanced Packaging Engineer:
•Lead initiatives in advanced packaging technologies, with a focus on CoWoS and related high-density integration techniques.
•Wear multiple hats-technical leadership, cross-functional collaboration, and hands-on problem solving.
•Provide technical direction on 3D stacking and other emerging packaging technologies.
Qualifications of the Advanced Packaging Engineer:
•Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related field.
•15+ years of experience in advanced semiconductor packaging, with a proven track record of driving complex initiatives.
•Deep understanding of CoWoS and other high-performance packaging technologies.
•Strong system-level background, with experience integrating packaging into full electronic systems.
Compensation for the Advanced Packaging Engineer:
•$190,000 - $270,000 annually with comprehensive benefits: Medical, Dental, Vison, 401k, PTO, holidays, sick leave as required by law
This job opens for applications on 7/18/2025. Applications for this job will be accepted for at least 30 days from the posting date.
Keywords: Advanced Packaging, CoWoS, TSMC, Semiconductor Packaging, System Integration, 3D Stacking, Packaging Solutions, Mechanical Engineering, Electrical Engineering, Materials Science, Hybrid Integration, IC Packaging, Heterogeneous Integration, Packaging Architecture, Cross-Functional Collaboration, Global Engineering Teams, Packaging Design, High-Density Interconnect, Thermal Management, Signal Integrity, Senior Engineer, Packaging Technology, Semiconductor Systems, Foundry Collaboration, Packaging Innovation
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- Location:
- Saratoga
